AUTOMATIC CONTROL SYSTEM FOR HIGH SPEED ELECTROLESS COPPER PLATING.

被引：0

作者：

Homma, Hideo

Waku, Akio

机构：

来源：

New Materials & New Processes | 1983年 / 2卷

关键词：

ELECTROLESS COPPER PROCESS - PHOTO SENSOR;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：236 / 242

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[1] ELECTROLESS PLATING.
Orchard, S.W.
CHEMSA, 1987, 13 (08): : 222 - 224
[2] ELECTROLESS COMPOSITE PLATING.
Feldstein, N.
Lancsek, T.
Lindsay, D.
Salerno, L.
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[3] APPLICATION FOR ELECTROLESS NICKEL PLATING.
Nelson, C.E.
Product Finishing (London), 1984, 37 (05): : 41 - 42
[4] HIGH-SPEED ELECTRONICS PLATING.
Turner, Dennis R.
Products Finishing (Cincinnati), 1987, 51 (05): : 66 - 73
[5] HIGH-SPEED SULFAMATE NICKEL PLATING.
Anon
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[6] Electroless tin plating. A new process
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[7] The kinetic H/D isotope effect in electroless copper plating. A DEMS study
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[8] The kinetic H/D isotope effect in electroless copper plating. An EQCM study
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Juzeliunas, E
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[9] Large Installation for Electroless Hard Nickel Plating.
Meyer, Kurt
Galvanotechnik, 1974, 65 (04): : 302 - 306
[10] EFFECTS OF ULTRASONIC IRRADIATION ON ELECTROLESS NICKEL PLATING.
Mallory, G.O.
Transactions of the Institute of Metal Finishing, 1600, 56 (pt 2): : 81 - 86