Improved plating of PCB small holes using 'pulse plating' of acid copper

被引:0
|
作者
机构
来源
Prod Finish (London) | / 5卷 / 3pp期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [1] IMPROVED PLATING OF SMALL HOLES AND OTHER BENEFITS FOUND USING PULSE PLATING OF ACID COPPER IN PCB MANUFACTURE
    COUGHLAN, S
    TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 1995, 73 : 54 - 57
  • [2] The effect of waveform for pulse plating on copper plating distribution of microvia in PCB manufacture
    K. C. Yung
    K. C. Chan
    T. M. Yue
    K. F. Yeung
    The International Journal of Advanced Manufacturing Technology, 2004, 23 : 245 - 248
  • [3] The effect of waveform for pulse plating on copper plating distribution of microvia in PCB manufacture
    Yung, KC
    Chan, KC
    Yue, TM
    Yeung, KF
    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2004, 23 (3-4): : 245 - 248
  • [4] The effect of waveform for pulse plating on copper plating distribution of microvia in PCB manufacture
    Yung, K.C.
    Chan, K.C.
    Yue, T.M.
    Yeung, K.F.
    International Journal of Advanced Manufacturing Technology, 2004, 23 (3-4): : 245 - 248
  • [5] The effects of pulse plating parameters on copper plating distribution of microvia in PCB manufacture
    Yung, KC
    Yue, TM
    Chan, KC
    Yeung, KF
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2003, 26 (02): : 106 - 109
  • [6] EFFECT OF BATH COMPOSITION AND PLATING VARIABLES ON COPPER PLATING INTO SMALL HOLES
    TURNER, DR
    HAVENS, BR
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1975, 122 (08) : C255 - C255
  • [8] Electroless copper plating of small via holes
    Abe, S.
    Ohkubo, M.
    Fujinami, T.
    Honma, H.
    Transactions of the Institute of Metal Finishing, 1998, 76 (pt 1): : 12 - 15
  • [9] The electroless copper plating of small via holes
    Abe, S
    Ohkubo, M
    Fujinami, T
    Honma, H
    TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 1998, 76 : 12 - 15
  • [10] Pulse plating in PCB manufacturing
    Leban, A
    Voncina, D
    Zevnik, C
    Fister, J
    INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS, 2004, 34 (03): : 160 - 167