ALUMINUM FLAKE FILLED CONDUCTIVE PLASTICS FOR EMI SHIELDING AND THERMAL CONDUCTIVITY.

被引：0

作者：

Holbrook, Amy L. ^{[1
]}

机构：

[1] Transmet Corp, Columbus, OH, USA, Transmet Corp, Columbus, OH, USA

来源：

International Journal of Powder Metallurgy (Princeton, New Jersey) | 1986年 / 22卷 / 01期

关键词：

D O I：

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中图分类号：

学科分类号：

摘要：

ALUMINUM AND ALLOYS

引用

页码：41 / 42

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