Influence of interfacial copper during the dealloying and nitridation of Cu-Ti films

被引：0
|
作者：
Arizona State Univ, Tempe, United States [1 ]
机构：
来源：
Mater Chem Phys | / 2-3卷 / 248-251期
基金：
美国国家科学基金会;
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] Influence of interfacial copper during the dealloying and nitridation of Cu-Ti films
    Alford, TL
    Adams, D
    Theodore, ND
    Laursen, T
    Kim, MJ
    MATERIALS CHEMISTRY AND PHYSICS, 1996, 46 (2-3) : 248 - 251
  • [2] Influence of interfacial copper on the Ti-SiO2 reaction during nitridation of Cu-Ti films
    Adams, D
    Alford, TL
    Theodore, ND
    Laursen, T
    Russell, SW
    Kim, MJ
    THERMODYNAMICS AND KINETICS OF PHASE TRANSFORMATIONS, 1996, 398 : 631 - 636
  • [3] Cu-Ti (copper-titanium)
    Okamoto, H
    JOURNAL OF PHASE EQUILIBRIA, 2002, 23 (06): : 549 - 550
  • [4] Thermal oxidation of thin Cu-Ti films
    Khoviv, AM
    Malevskaya, LA
    Pribytkov, DM
    Zavalishin, EI
    INORGANIC MATERIALS, 2004, 40 (02) : 171 - 175
  • [5] Formation of passivation and adhesion layers for Cu via nitridation of Cu-Ti in an ammonia ambient
    Adams, D
    Alford, TL
    Rafalski, SA
    Rack, MJ
    Russell, SW
    Kim, MJ
    Mayer, JW
    MATERIALS CHEMISTRY AND PHYSICS, 1996, 43 (02) : 145 - 152
  • [6] Wettability and interfacial reaction of Cu-Ti filler metal on Nb
    Laboratory of Welding and Forging, Beijing Institute of Aeronautic Materials, Beijing 100095, China
    Cailiao Kexue yu Gongyi, 2009, SUPPL. 1 (21-24):
  • [7] Microstructure and mechanical properties of Cu-Ti alloy films
    Zhang, Anming
    Li, Yuge
    Shang, Hailong
    Ma, Bingyang
    Sun, Shiyang
    Li, Geyang
    Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2015, 44 (12): : 3224 - 3227
  • [8] Microstructure and Mechanical Properties of Cu-Ti Alloy Films
    Zhang Anming
    Li Yuge
    Shang Hailong
    Ma Bingyang
    Sun Shiyang
    Li Geyang
    RARE METAL MATERIALS AND ENGINEERING, 2015, 44 (12) : 3224 - 3227
  • [9] INTERFACIAL REACTION BETWEEN ALUMINA AND CU-TI FILLER METAL DURING REACTIVE METAL BRAZING
    BANG, KS
    LIU, S
    WELDING JOURNAL, 1994, 73 (03) : S54 - S60
  • [10] Interfacial reaction between alumina and Cu-Ti filler metal during reactive metal brazing
    Bang, K.-S.
    Liu, S.
    Welding Journal (Miami, Fla), 1994, 73 (03):
12345