ENGINEERING CHANGE METHOD NOT REQUIRING PADS.

A method is described to use spare chip inputs/outputs and wiring on a chip interposer to perform the engineering change (EC) function in modules. The method does not require pads, does not require space around the chip for EC pads, and does not require changes to the multi-level ceramic (MLC) substrate. With the new method, faulty substrate nets may be repaired without replacing the substrate. Substrate nets may be changed by using the buried channels in combination with wires added to the interposers. Temporary fixes in logic can be established, and no discrete wires are required.