Modification of the Preston equation for the chemical-mechanical polishing of copper

被引:0
|
作者
Clarkson Univ, Potsdam, United States [1 ]
机构
来源
Thin Solid Films | / 1-2卷 / 160-167期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [1] Modification of the Preston equation for the chemical-mechanical polishing of copper
    Luo, Q
    Ramarajan, S
    Babu, SV
    THIN SOLID FILMS, 1998, 335 (1-2) : 160 - 167
  • [2] CHEMICAL PROCESSES IN THE CHEMICAL-MECHANICAL POLISHING OF COPPER
    STEIGERWALD, JM
    MURARKA, SP
    GUTMANN, RJ
    DUQUETTE, DJ
    MATERIALS CHEMISTRY AND PHYSICS, 1995, 41 (03) : 217 - 228
  • [3] Chemical-mechanical polishing of copper with model slurries
    Lee, BC
    Duquette, DJ
    Gutmann, RJ
    ELECTROCHEMICAL SCIENCE AND TECHNOLOGY OF COPPER, PROCEEDINGS, 2002, 2000 (30): : 103 - 116
  • [4] Tribological behavior of copper chemical-mechanical polishing
    Xu, GH
    Liang, G
    SOLID-STATE AND INTEGRATED-CIRCUIT TECHNOLOGY, VOLS 1 AND 2, PROCEEDINGS, 2001, : 851 - 854
  • [5] Chemical-mechanical polishing of copper for interconnect formation
    Stavreva, Z
    Zeidler, D
    Plotner, M
    Grasshoff, G
    Drescher, K
    MICROELECTRONIC ENGINEERING, 1997, 33 (1-4) : 249 - 257
  • [6] Lubricating behavior in chemical-mechanical polishing of copper
    Liang, H
    Xu, GH
    SCRIPTA MATERIALIA, 2002, 46 (05) : 343 - 347
  • [7] CHEMICAL-MECHANICAL POLISHING OF COPPER FOR MULTILEVEL METALLIZATION
    STAVREVA, Z
    ZEIDLER, D
    PLOTNER, M
    DRESCHER, K
    APPLIED SURFACE SCIENCE, 1995, 91 (1-4) : 192 - 196
  • [8] Chemical-mechanical polishing of copper in alkaline media
    Luo, Q
    Campbell, DR
    Babu, SV
    THIN SOLID FILMS, 1997, 311 (1-2) : 177 - 182
  • [9] Characteristics in chemical-mechanical polishing of copper: Comparison of polishing pads
    Stavreva, Z
    Zeidler, D
    Plotner, M
    Drescher, K
    APPLIED SURFACE SCIENCE, 1997, 108 (01) : 39 - 44
  • [10] Influence of process parameters on chemical-mechanical polishing of copper
    Stavreva, Z
    Zeidler, D
    Plotner, M
    Drescher, K
    MICROELECTRONIC ENGINEERING, 1997, 37-8 (1-4) : 143 - 149