Low-profile power pack for ISDN systems under forced air convection

被引：0
|
作者：
Murakami, Naoki
Yachi, Toshiaki
Yumoto, Ichiro
Maki, Katsuro
机构：
来源：
NTT R and D | 1994年 / 43卷 / 08期
关键词：
Electric rectifiers - MOSFET devices - Power supply circuits - Voice/data communication systems;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
A highly efficient, low-profile 300-W power pack has been developed for telecommunications systems. To reduce power loss and component height, the power stage is divided into three 100-W on-board power supply modules connected in parallel. A simple and efficient MOSFET synchronous rectifier, suitable for on-board power supply modules connected in parallel, increases power supply module efficiency to over 91%. As a result, the power pack has 90% efficiency at 5 V for 60-A output, while being only 10 mm wide. This power pack can be assembled within a 15.24-mm pitch in a plug-in unit.
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页码：897 / 904
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