Heat resistance of Sn-9Zn solder/Cu interface with or without coating

被引：0
|
作者：
Suganuma, Katsuaki [1 ]
Murata, Toshikazu [1 ]
Noguchi, Hiroji [1 ]
Toyoda, Yoshitaka [1 ]
机构：
[1] Inst. of Scientific and Indust. Res., Osaka University, Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan
来源：
| 2000年 / Materials Research Society卷 / 15期
关键词：
Interfacial morphology;
D O I：
10.1557/jmr.2000.0126
中图分类号：
学科分类号：
摘要：
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