Thermal shock test of IC packages sealed with epoxy molding compounds filled with irregular-shaped silica particles

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[1] Nakamura, Yoshinobu
[2] Yamaguchi, Miho
[3] Tanaka, Atsushi
[4] Okubo, Masayoshi
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Nakamura, Yoshinobu | 1600年 / 49期
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Epoxy resins;
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