NEW TECHNOLOGIES AND MATERIALS FOR BONDING WOOD PRODUCTS.

被引：0
|
作者：
Myers, George E. [1 ]
机构：
[1] USDA, Madison, WI, USA, USDA, Madison, WI, USA
来源：
Adhesives Age | 1988年 / 31卷 / 11期
关键词：
ADHESIVES - COMPOSITE STRUCTURES - PARTICLE BOARD - Bonding;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The author provides background data on the use of particle board, waferboard, and hardwood plywood. In addition, data on UF adhesives, gap-filling adhesives, resorcinol-formaldehyde adhesives, melamines, isocyanates and PVA adhesives are presented. A description is also given of adhesive bonding techniques that are coming into use. 14 Refs.
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页码：31 / 36
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