共 50 条
- [3] A simplified model of the reflow soldering process [J]. ITHERM 2002: EIGHTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, PROCEEDINGS, 2002, : 840 - 847
- [5] The laser in manufacture - Its use in the soldering of electronic component assemblies [J]. ADVANCED MANUFACTURING PROCESSES, SYSTEMS, AND TECHNOLOGIES (AMPST 96), 1996, : 391 - 397
- [7] Automated adaptive control of the reflow soldering of electronic assemblies [J]. TWENTY FIRST IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 1997, : 229 - 236
- [10] Fracture analysis of electronic IC package in reflow soldering process [J]. KSME INTERNATIONAL JOURNAL, 2004, 18 (03): : 357 - 369