Improving the yield of printed circuit boards using design of experiments

The high market demands of printed circuit boards are pushing the manufacturers for more and more complex products in terms of its specifications. The increase in product complexity leads to a higher defect rate during manufacturing, resulting in higher cost. To be competitive in the market in terms of quality and cost, it is necessary for the manufacturer to improve the process continuously to meet the challenging requirements from customers. Optimization of the process parameters in inner-layer fabrication helped in reducing the rejection rate by more than half of the previous level. The improvement achieved in yield gives more confidence for the company to manufacture finer line circuits and therefore help to capture more of the market share.