Transient liquid-phase bonding in the NiAl/Cu/Ni system - a microstructural investigation

被引：0
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作者：
Gale, W.F. [1 ]
Guan, Y. [1 ]
机构：
[1] Auburn Univ, Auburn, United States
来源：
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | 1996年 / 27 A卷 / 11期
关键词：
Adhesive joints - Austenite - Bonding - Crystal microstructure - Intermetallics - Metal melting - Metallographic microstructure - Precipitation (chemical) - Scanning electron microscopy - Solidification - Transmission electron microscopy;
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页码：3621 / 3629
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