Known good die: KGD provides unique benefits for future packaging applications

被引：0
|
作者：
Murray, Warren [1 ]
机构：
[1] Aehr Test Systems, 1667 Plymouth Street, Mountain View, CA 94043, United States
来源：
Advanced Packaging | / 8卷 / 06期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
下载
收藏
页码：72 / 76
相关论文
共 5 条
  • [1] Screening for known good die (KGD) based on defect clustering: An experimental study
    Singh, AD
    Nigh, P
    Krishna, CM
    ITC - INTERNATIONAL TEST CONFERENCE 1997, PROCEEDINGS: INTEGRATING MILITARY AND COMMERCIAL COMMUNICATIONS FOR THE NEXT CENTURY, 1997, : 362 - 369
  • [2] Test methods used to produce highly reliable known good die (KGD)
    Arnold, R
    Menon, SM
    Brackett, B
    Richmond, R
    1998 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING, PROCEEDINGS, 1998, : 374 - 382
  • [3] Will Chip Scale Packaging replace Known Good Die?
    Gurnett, K
    MICROELECTRONICS JOURNAL, 1997, 28 (6-7) : R17 - R24
  • [4] Full wafer contact technology: A KGD enabler - Delivering true known good die
    Pitts, John
    Advanced Packaging, 2004, 13 (12): : 24 - 27
  • [5] ULTA-THIN PACKAGING VERSUS THE KNOWN GOOD DIE
    GURNETT, K
    MICROELECTRONICS JOURNAL, 1994, 25 (08) : R23 - R26
1