Advances in bioelectronics lead to retinal prosthesis

被引：0
|
作者：
Baldwin, Daniel F. [1 ]
Shire, Douglas [2 ]
机构：
[1] Engent Inc., 3140 Northwoods Parkway, Norcross, GA 30071
[2] VA Ctr. for Innov. Vis. Rehab., 119 Phillips Hall, Cornell University, Ithaca, NY 14853
来源：
Advanced Packaging | 2004年 / 13卷 / 10期
关键词：
Data coils - Electrode arrays - Photoreceptor cells - Solder bumping;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
(Edited Abstract)
引用
收藏
页码：16 / 17
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