Cu-Ni-Sn (copper-nickel-tin) system

被引：0
|
作者：
Gupta, K.P. [1 ]
Rajendraprasad, S.B. [1 ]
Ramakrishna, D. [1 ]
Jena, A.K. [1 ]
机构：
[1] Indian Inst of Technology, India
来源：
Journal of Alloy Phase Diagrams | 1988年 / 4卷 / 03期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
25
引用
收藏
页码：160 / 174
相关论文
共 50 条
  • [21] Thermal stability of barrierless Cu-Ni-Sn films
    Li, X. N.
    Wang, M.
    Zhao, L. R.
    Bao, C. M.
    Chu, J. P.
    Dong, C.
    APPLIED SURFACE SCIENCE, 2014, 297 : 89 - 94
  • [22] DEFORMATION STUDIES ON CU-NI-SN SPINODAL ALLOYS
    SHEKHAR, S
    LEE, TC
    SUBRAMANIAN, KN
    PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1985, 91 (01): : 63 - 72
  • [23] SPINODAL CU-NI-SN ALLOYS FOR ELECTRONIC APPLICATIONS
    SCOREY, CR
    CHIN, S
    WHITE, MJ
    LIVAK, RJ
    JOURNAL OF METALS, 1984, 36 (11): : 52 - 54
  • [24] EFFECTS OF TIN ON HARDNESS, WEAR RATE AND COEFFICIENT OF FRICTION OF CAST CU-NI-SN ALLOYS
    Ilangovan, S.
    Sellamuthu, R.
    JOURNAL OF ENGINEERING SCIENCE AND TECHNOLOGY, 2013, 8 (01) : 34 - 43
  • [25] Phase transformations and phase diagram at equilibrium in the Cu-Ni-Sn system - Preface
    Coquerel, Gerard
    JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, 2007, 90 (02) : 317 - 317
  • [26] HEAT-TREATMENT OF THE CU-NI-SN ALLOYS
    KRATOCHVIL, P
    MENCL, J
    SAXLOVA, M
    KOVOVE MATERIALY-METALLIC MATERIALS, 1983, 21 (04): : 453 - 460
  • [27] EFFECT OF SN COMPONENT ON PROPERTIES AND MICROSTRUCTURE CU-NI-SN ALLOYS
    Nguyen, D. N.
    Hoang, A. T.
    Pham, X. D.
    Sai, M. T.
    Chau, M. Q.
    Pham, V. V.
    JURNAL TEKNOLOGI, 2018, 80 (06): : 43 - 52
  • [28] NEW MATERIAL FOR SUBMINATURE CONNECTORS: COPPER-NICKEL-TIN ALLOY.
    De Vanssay, J.-M.
    1600, (75): : 1 - 2
  • [29] CONSTITUTION AND MAGNETIC-PROPERTIES OF THE CU-NI-SN TERNARY-SYSTEM
    WACHTEL, E
    BAYER, E
    ZEITSCHRIFT FUR METALLKUNDE, 1984, 75 (01): : 61 - 69
  • [30] SPINODAL CU-NI-SN ALLOYS ARE STRONG AND SUPERDUCTILE
    PLEWES, JT
    METAL PROGRESS, 1974, 106 (02): : 46 - &
12345