共 50 条
- [3] EXTENDED LAYERING ALGORITHM FOR MULTILAYER PRINTED WIRING BOARDS. [J]. Transactions of the Institute of Electronics, Information and Communication Engineers, Section E (, 1987, E70 (10): : 906 - 908
- [5] RESULTS OF RELIABILITY TESTS WITH RIGID PRINTED WIRING BOARDS. [J]. Insulation/Circuits, 1979, 25 (08): : 20 - 23
- [6] ASSEMBLING 963 BELLPAC CONNECTORS TO PRINTED WIRING BOARDS. [J]. Engineer (New York), 1983, 27 (03): : 22 - 27
- [7] HIGH DENSITY METAL CORE PRINTED WIRING BOARDS. [J]. NEC Research and Development, 1979, (54): : 14 - 19
- [8] APPROACH OF GATE ASSIGNMENT AND MODULE PLACEMENT FOR PRINTED WIRING BOARDS. [J]. Systems, computers, controls, 1980, 11 (03): : 54 - 65
- [9] CMOS Modules in Practice. Avoid Interference by Proper Design of Printed Wiring Boards. [J]. Elektronik Munchen, 1986, 35 (20): : 95 - 96
- [10] KERIMID 601 POLYIMIDE RESIN FOR MULTILAYER PRINTED WIRING BOARDS. [J]. SAMPE Quarterly, 1974, 6 (01): : 33 - 39