Copper metallization of Teflon AF1600, using evaporation and sputtering, for multilevel interconnect devices

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Dept. de Génie Physique, Groupe des Couches Minces, Ecl. Polytech. de Montréal, Succursale Centre-Ville, Montréal, Que. H3C 3A7, Canada [1 ]
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Microelectron Eng | / 1-4卷 / 217-221期
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We thank the Natural Sciences and Engineering Research Council of Canada and the Fonds pour la Formation de Chercheurs et l'Aide ~ la Recherche du Quebec for funding;
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