Plastic packaging consortium: Plastic package thermal dissipation

被引：0
|
作者：
Tracy, Daniel [1 ]
Nguyen, Luu [1 ]
Giberti, Richard [1 ]
Gallo, Anthony [1 ]
Bischof, Charles [1 ]
Jonczak, C.J. [1 ]
Wohlin, John [1 ]
机构：
[1] Natl Semiconductor Corp, Santa Clara, United States
来源：
Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium | 1997年
关键词：
D O I：
April 16, 1997 - April 18, 1997
中图分类号：
学科分类号：
摘要：
Electronics packaging
引用
收藏
页码：290 / 294
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