Metal coatings - effects of deuterium irradiation on copper deposited aluminum 6061 substrates

被引：0
|
作者：
Battal, T. [1 ]
Inal, O.T. [1 ,3 ]
Kurz, K.L. [2 ]
Causey, R.A. [2 ]
机构：
[1] Materials and Metallurgical Engineering Department, New Mexico Tech, Socorrom, NM 87801, United States
[2] Sandia National Laboratories, Advanced Materials Research Department, Livermore, CA 94550, United States
[3] New Mexico Institute of Mining and Technology, Socorro, NM, United States
来源：
| 2000年 / Matrice Tech Ltd., Sidcup, United Kingdom卷 / 15期
关键词：
Adhesion - Coated materials - Copper - Deuterium - Ion implantation - Residual stresses - Stress analysis - Substrates - Vapor deposition;
D O I：
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学科分类号：
摘要：
Elemental pure copper was deposited on Al 6061 substrates at varying temperatures using a novel technique based on plasma assisted physical vapor deposition. The copper coated substrates were then irradiated by a deuterium accelerator at 40+120 keV in a multienergetic cycle, which resulted in ion implantation with a total fluence of 3×1017 ions/cm2. Characterization of the irradiated samples revealed that coating pure copper onto the surface promoted the recombination of deuterium on the copper surface without its permeation into the substrate Al.
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