Interfaces and ductility-toughness in TiAl intermetallic compounds

被引:0
|
作者
He, L.L. [1 ]
Ye, H.Q. [1 ]
机构
[1] Chinese Acad of Sciences, Shenyang, China
关键词
D O I
暂无
中图分类号
学科分类号
摘要
5
引用
收藏
页码:613 / 616
相关论文
共 50 条
  • [1] Interfaces and ductility-toughness in TiAl intermetallic compounds
    He, LL
    Ye, HQ
    INTERGRANULAR AND INTERPHASE BOUNDARIES IN MATERIALS, PT 2, 1996, 207- : 613 - 616
  • [2] DUCTILITY-TOUGHNESS IMPROVEMENT IN IRON-BASE ALLOY STRENGTHENED BY INTERMETALLIC PRECIPITATES BY CONTROLLED ROLLING TECHNIQUES
    KRISHNADEV, MR
    GALIBOIS, A
    ENGINEERING FRACTURE MECHANICS, 1979, 11 (02) : 460 - 460
  • [3] IMPROVING INTERMETALLIC DUCTILITY AND TOUGHNESS
    BAKER, I
    MUNROE, PR
    JOURNAL OF METALS, 1988, 40 (02): : 28 - 31
  • [4] Ductility in intermetallic compounds
    Russell, AM
    ADVANCED ENGINEERING MATERIALS, 2003, 5 (09) : 629 - 639
  • [5] Machinability of TiAl intermetallic compounds
    Furusawa, T
    Ichikawa, A
    Hino, H
    Tsuji, S
    Koroyasu, S
    INITIATIVES OF PRECISION ENGINEERING AT THE BEGINNING OF A MILLENNIUM, 2001, : 289 - 293
  • [6] INTERMETALLIC COMPOUNDS - DUCTILITY AND STRENGTH
    BANERJEE, D
    SUNDARARAJAN, G
    INDIAN JOURNAL OF TECHNOLOGY, 1990, 28 (6-8): : 259 - 280
  • [7] Advances in fabrication process and improvement of the ductility and toughness of NiAl and intermetallic compounds for structural application
    Li Hutian
    Guo Hanting
    Ye Hengqiang
    RARE METAL MATERIALS AND ENGINEERING, 2006, 35 (07) : 1162 - 1166
  • [8] DUCTILITY OF HIGH-PURITY TIAL INTERMETALLIC COMPOUND
    MURATA, Y
    MORINAGA, M
    TAKEDA, Y
    MATERIALS TRANSACTIONS JIM, 1992, 33 (04): : 419 - 421
  • [9] Fracture toughness testing of TiAl base intermetallic alloys
    Dogan, B
    Schwalbe, KH
    ENGINEERING FRACTURE MECHANICS, 1997, 56 (02) : 155 - 165
  • [10] Grain Refiner for TiAl Intermetallic Compounds
    Yuehui HE
    Yexiang LIU
    Baiyun HUANG
    Xuanhui QU and Changming LEI (Powder Metallurgy Research Institute
    JournalofMaterialsScience&Technology, 1994, (03) : 205 - 208