MICROCIRCUIT RELIABILITY ASSESSMENT THROUGH ACCELERATED TESTING.

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作者：
Lehtonen, David E.
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Electronic Packaging and Production | 1977年 / 17卷 / 07期
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Accelerated stress testing as a means of assessing reliability is a viable approach to rapid evaluation of time-temperature and time-pressure related failure mechanisms. Early detection of time-dependent failures is possible through the implementation of an accelerated testing program. It is pointed out that before designing an accelerated testing program it is necessary to understand the failure mechanisms as they relate to either oxide, metallization of packaging problems.
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页码：288 / 289
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