首页
学术期刊
论文检测
AIGC检测
热点
更多
数据
Advanced packaging
被引:0
|
作者
:
Murray, Jerry
论文数:
0
引用数:
0
h-index:
0
Murray, Jerry
机构
:
来源
:
Printed Circuit Fabrication
|
1994年
/ 17卷
/ 04期
关键词
:
D O I
:
暂无
中图分类号
:
学科分类号
:
摘要
:
引用
收藏
相关论文
共 50 条
[1]
Advanced packaging
Anon
论文数:
0
引用数:
0
h-index:
0
Anon
Electronic Packaging and Production,
2001,
41
(06):
[2]
Advanced packaging
2001,
Cahners Publishing Co. Inc.
(41):
[3]
Advanced packaging
Anon
论文数:
0
引用数:
0
h-index:
0
Anon
Electronic Packaging and Production,
2001,
41
(07):
[4]
Advanced packaging solutions
不详
论文数:
0
引用数:
0
h-index:
0
不详
FLEISCHWIRTSCHAFT,
2024,
104
(09):
[5]
Advanced Packaging: Editorial
Demmin, Jeffrey C.
论文数:
0
引用数:
0
h-index:
0
Demmin, Jeffrey C.
Advanced Packaging,
2002,
11
(11):
[6]
Advanced and safe packaging
Nowoczesne i bezpieczne opakowania
论文数:
0
引用数:
0
h-index:
0
Nowoczesne i bezpieczne opakowania
Zubrzak, M.,
1600,
Sigma Not
(70):
[7]
Advanced microelectronic packaging
Markovich, Voya
论文数:
0
引用数:
0
h-index:
0
机构:
Endicott Interconnect Technollogies Inc., 1093 Clark Street, Endicott, NY 13760, United States
Endicott Interconnect Technollogies Inc., 1093 Clark Street, Endicott, NY 13760, United States
Markovich, Voya
Advancing Microelectronics,
2012,
39
(04):
[8]
Advanced Packaging: Editorial
Demmin, Jeffrey C.
论文数:
0
引用数:
0
h-index:
0
Demmin, Jeffrey C.
2002,
IHS Publishing Group
(11):
[9]
ADVANCED PACKAGING FOR VLSI
BARTLETT, CJ
论文数:
0
引用数:
0
h-index:
0
BARTLETT, CJ
SOLID STATE TECHNOLOGY,
1986,
29
(06)
: 119
-
123
[10]
Advanced Packaging: Editorial
Demmin, Jeffrey C.
论文数:
0
引用数:
0
h-index:
0
Demmin, Jeffrey C.
Advanced Packaging,
2002,
11
(06):
←
1
2
3
4
5
→