ACCURATE, NON-DESTRUCTIVE, RAPID AUTOMATABLE METHOD TO MEASURE C4 VOLUMES AND HEIGHTS.

Rapid detection of chips which have reduced solder volume on one or more pads, high voids, or other chip yield detractors and rapid determination and detection of low chip heights or high chip tilt, or other module yield detractors, are desired. An X-ray photograph or fluoroscope provides density data of solder mounds on a C4 pad for flip-chip bonding, and integration of the density over the projected area of the pad is a direct measurement of its volume. Other uses for this tool, which may be accomplished simultaneously with the volume measurement are indicated.