NEW SEMICRYSTALLINE REINFORCED POLYAMIDE ENGINEERING THERMOPLASTIC.

A new rapidly crystallizing aromatic-aliphatic polyamide has been developed by reacting 4,4 prime -methylene bis-(phenylisocyanate) (MDI) with aliphatic dicarboxylic acids. The polymer has a T//g of 130 degree C and T//m of 290 degree C. Glass reinforced resin shows better flexural creep resistance at high stress levels (3000 psi) at elevated temperatures (75 degree C) than most reinforced semicrystalline commercial polymers i. e. , nylons, thermoplastic polyesters and acetal because of its high T//g. Glass reinforced polyamide can be injection molded on conventional equipment to afford flexural moduli in excess of 1,000,000 psi and HDT's as high as 250 degree C at 264 psi.