Efficient numerical technique for thermal characterization of printed wiring boards

被引：0
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作者：
Stefani, G.G. [1 ]
Goel, N.S. [1 ]
Jenks, D.B. [1 ]
机构：
[1] State Univ of New York, Binghamton, United States
来源：
Journal of Electronic Packaging, Transactions of the ASME | 1993年 / 115卷 / 04期
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页码：366 / 372
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