Vapor-spreading heat sink promises to keep future chips cool

被引:0
|
作者
机构
来源
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:24 / 25
相关论文
共 1 条
  • [1] Two-Phase Vapor Chambers with Micropillar Evaporators: A New Approach to Remove Heat from Future High-Performance Chips
    Yuan, Zihao
    Vaartstra, Geoffrey
    Shukla, Prachi
    Said, Mostafa
    Reda, Sherief
    Wang, Evelyn
    Coskun, Ayse K.
    [J]. PROCEEDINGS OF THE 2019 EIGHTEENTH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2019), 2019, : 456 - 464