Improving integrated circuits assembly quality - a case study

被引:0
|
作者
Whitfield, R. C.
Kwok, K.-M.
机构
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [1] Improving service delivery through integrated quality initiatives: A case study
    Hickey, J.
    Siegel, J.
    IBM SYSTEMS JOURNAL, 2008, 47 (01) : 167 - 178
  • [2] Thermal testing of analogue integrated circuits: A case study
    Altet, J
    Ivanov, A
    Wong, A
    JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2003, 19 (03): : 353 - 357
  • [3] Thermal Testing of Analogue Integrated Circuits: A Case Study
    J. Altet
    A. Ivanov
    A. Wong
    Journal of Electronic Testing, 2003, 19 : 353 - 357
  • [4] MULTICHIP ASSEMBLY WITH FLIPPED INTEGRATED-CIRCUITS
    HEINEN, KG
    SCHROEN, WH
    EDWARDS, DR
    WILSON, AM
    STIERMAN, RJ
    LAMSON, MA
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1989, 12 (04): : 650 - 657
  • [5] ASSEMBLY AND PACKAGING TECHNOLOGY FOR INTEGRATED-CIRCUITS
    ROSE, AS
    SAMPE JOURNAL, 1982, 18 (04) : 16 - 19
  • [6] Improving the Performance of Assembly Line: Review with case study
    Rane, Arun B.
    Sunnapwar, Vivek K.
    Sudhakar, D. S. S.
    Rane, Santosh
    2015 INTERNATIONAL CONFERENCE ON NASCENT TECHNOLOGIES IN THE ENGINEERING FIELD (ICNTE), 2015,
  • [7] A case study on improving productivity in paint booth assembly
    Jayakumar, P.
    Kumar, V. R. Sathish
    MATERIALS TODAY-PROCEEDINGS, 2022, 62 : 1054 - 1059
  • [8] The Process of Improving the Quality of Teaching - A Case Study
    Andersen, Kristinn
    Thorsteinsson, Saemundur E.
    Thorbergsson, Helgi
    Gudmundsson, Karl S.
    2018 28TH EAEEIE ANNUAL CONFERENCE (EAEEIE), 2018,
  • [9] New prototype assembly methods for biosensor integrated circuits
    Graham, Anthony H. D.
    Bowen, Chris R.
    Surguy, Susan M.
    Robbins, Jon
    Taylor, John
    MEDICAL ENGINEERING & PHYSICS, 2011, 33 (08) : 973 - 979
  • [10] Improving symbolic analysis in CMOS analog integrated circuits
    Aguila-Meza, J
    Torres-Papaqui, L
    Tlelo-Cuautle, E
    2004 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOL 5, PROCEEDINGS, 2004, : 193 - 196