Stress effects on Al and Al(Cu) thin film grain-boundary diffusion

被引：0

作者：

Liu, X.-Y. ^{[1
]}

Liu, C.-L. ^{[1
]}

机构：

[1] Motorola Inc, Los Alamos, United States

来源：

Materials Research Society Symposium - Proceedings | 2000年 / 594卷

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Metallic films

引用

页码：451 / 456

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