SYSTEM CONTROL REDUCES COMPONENT STRESS DURING BOARD PROCESSING.

被引：0
|
作者：
Leonard Jr., Harlan [1 ]
机构：
[1] Bourns Inc, Riverside, CA, USA, Bourns Inc, Riverside, CA, USA
来源：
Electronic Packaging and Production | 1984年 / 24卷 / 08期
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页码：142 / 145
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