Fundamental study on silver flakes for conductive adhesives

被引：0
|
作者：
Lu, Daoqiang [1 ]
Wong, C.P. [1 ]
Tong, Quinn K. [1 ]
机构：
[1] Georgia Tech, Atlanta, United States
来源：
Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces | 1998年
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页码：256 / 260
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