共 50 条
- [1] FACTORS AFFECTING TUNGSTEN-COPPER AND TUNGSTEN-SILVER ELECTRICAL CONTACT MATERIALS POWDER METALLURGY INTERNATIONAL, 1982, 14 (03): : 139 - &
- [2] HIGH DENSITY TUNGSTEN-SILVER P/M MATERIALS. The International journal of powder metallurgy & powder technology, 1983, 19 (04): : 299 - 300
- [5] PROPERTIES OF SINTERED AND INFILTRATED TUNGSTEN-COPPER ELECTRICAL CONTACT MATERIAL INTERNATIONAL JOURNAL OF POWDER METALLURGY, 1981, 17 (04): : 297 - &
- [6] PROPERTIES OF SINTERED AND INFILTRATED TUNGSTEN-COPPER ELECTRICAL CONTACT MATERIAL. The International journal of powder metallurgy & powder technology, 1981, 17 (04): : 297 - 298
- [8] HIGH-DENSITY TUNGSTEN-SILVER P/M MATERIALS INTERNATIONAL JOURNAL OF POWDER METALLURGY, 1983, 19 (04): : 299 - &
- [9] USING MOLYBDENUM AND TUNGSTEN AS CONTACT MATERIALS. Insulation, circuits, 1982, 28 (04): : 41 - 43