PROCESS EQUIPMENT ISSUES IN LEADING-EDGE PRACTICE.

A discussion is presented of issues involved in the successful integration of process equipment into world-class microelectronic manufacturing operations and facilities. Specific improvements needed in process equipment are identified. Process equipment as a contamination source, process equipment cleanliness, and wafer handling are examined. It is shown that the major effort in improving microelectronic manufacturing over the next several years will be the development of process equipment that fully meets manufacturing cleanliness needs, can be effectively integrated into the latest-generation cleanrooms, meets maintainability requirements, and can reliably process 1- mu m technology. Of these problems, meeting the cleanliness/maintainability requirements in a real manufacturing environment will be the most difficult challenge.