Antiplane strain problems of circular-arc cracks between bonded dissimilar piezoelectric materials under concentrated forces

被引：0

作者：

Hou, Mi-shan ^{[1
]}

Yang, Xiu-juan ^{[1
]}

机构：

[1] Univ of Petroleum, Dongying, China

来源：

Gong Cheng Li Xue/Engineering Mechanics | 1998年 / 15卷 / 01期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：110 / 114

共 13 条

[1] PROBLEMS OF COLLINEAR CRACKS BETWEEN BONDED DISSIMILAR MATERIALS UNDER ANTIPLANE CONCENTRATED FORCES
刘又文
蒋持平
Applied Mathematics and Mechanics(English Edition), 1990, (10) : 955 - 964
[2] PROBLEM ON CIRCULAR-ARC CRACKS BETWEEN BONDED DISSIMILAR MATERIALS UNDER CONCENTRATED FORCE AND MOMENT
刘又文
蒋持平
Applied Mathematics and Mechanics(English Edition), 1987, (03) : 271 - 282
[3] Problems of antiplane strain of electrically permeable cracks between bonded dissimilar piezoelectric materials
Hou, MS
Mei, FL
CHINESE SCIENCE BULLETIN, 1998, 43 (04): : 341 - 345
[4] Problems of antiplane strain of electrically permeable cracks between bonded dissimilar piezoelectric materials
HOU Mishan and MEI Fuliang University of Petroleum
ChineseScienceBulletin, 1998, (04) : 341 - 345
[5] Intensity factors of electrically permeable interfacial cracks of antiplane strain problems in bonded dissimilar piezoelectric materials
Liu, Xin-min
Hou, Mi-shan
2000, Tsinghua Univ, Beijing, China (17):
[6] EXPLICIT SOLUTIONS FOR THE ANTIPLANE PROBLEM OF BONDED DISSIMILAR MATERIALS WITH 2 CONCENTRIC CIRCULAR-ARC INCLUSIONS
CHAO, CK
WU, SP
JOURNAL OF ENERGY RESOURCES TECHNOLOGY-TRANSACTIONS OF THE ASME, 1995, 117 (01): : 1 - 6
[7] PROBLEMS ON COLLINEAR CRACKS BETWEEN BONDED DISSIMILAR MATERIALS UNDER CONCENTRATED LOADS
蒋持平
刘又文
AppliedMathematicsandMechanics(EnglishEdition), 1988, (02) : 167 - 177
[8] Antiplane Interfacial Wedge Cracks between Dissimilar Bonded Piezoelectric Materials under Electrically Mixed Condition
Choi, Sung Ryul
Chung, Ilsup
TRANSACTIONS OF THE KOREAN SOCIETY OF MECHANICAL ENGINEERS A, 2022, 46 (04) : 341 - 353
[9] Thermal stresses for bonded dissimilar materials with a circular-arc anticrack
Shen, MH
Chao, CK
JOURNAL OF THERMAL STRESSES, 1999, 22 (07) : 637 - 657
[10] Fracture analysis of circular-arc interface cracks in piezoelectric materials
Gao, CF
Balke, H
INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2003, 40 (13-14) : 3507 - 3522

← 1 2 →