Analysis of thermal stress effect on electromigration failure time in Al alloy thin-film interconnects

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作者：
Lee, S.H. [1 ]
Kwon, D. [1 ]
机构：
[1] Div. of Mat. Science and Engineering, Seoul National University, 151-742, Seoul, Korea, Republic of
来源：
Thin Solid Films | 1999年 / 341卷 / 01期
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页码：136 / 139
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