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- [1] Improving A Soldering Process Applying The Dual Response Approach To A Taguchi's Orthogonal Array CIE: 2009 INTERNATIONAL CONFERENCE ON COMPUTERS AND INDUSTRIAL ENGINEERING, VOLS 1-3, 2009, : 1174 - 1178
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- [3] CFD Analysis of Wave Soldering Interpin Behaviour 2016 17TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2016,
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- [7] DFM of Soldering Pad of QFP and DIP for Wave Soldering 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 642 - 647
- [9] Design of experiments (DOE) of automatic soldering process "wave soldering" 27th International Spring Seminar on Electronics Technology, Books 1-3, Conference Proceedings: MEETING THE CHALLENGES OF ELECTRONICS TECHNOLOGY PROGRESS, 2004, : 338 - 341
- [10] Fluxless soldering in wave soldering equipment using forming gas Natl Electron Packag Prod Conf Proc Tech Program, (1513-1518):