IN-HOUSE WIRED BOARD PROCESS LENDS SPEED, FLEXIBILITY.

The wired board process is an automated interconnection system in which polyimide insulated magnet wire is laid down on an adhesive-coated substrate with or without etched power and ground planes. Terminations are formed by drilling through the wire and board, and plating the sides of the hole. The plated through-holes are used for component insertion and soldering. Use of insulated wires (usually 34 AWG) permits unlimited crossovers on each wiring plane, simplifying design and providing high interconnection density. The entire logic interconnection of the system is made by computer. It designs the routing of conductors and directs their placement by a numerically-controlled wiring machine. A minicomputer manufacturer, decided on the wired board process rather than on multilayers as a cost effective P/C assembly method. This article details the advantages of this system.