SOME COMPONENT LEAD SOLDERABILITY ISSUES.

被引：0

作者：

Wild, Roger N. ^{[1
]}

机构：

[1] IBM, Materials & Analysis Dep,, Owego, NY, USA, IBM, Materials & Analysis Dep, Owego, NY, USA

来源：

Brazing & soldering | 1985年 / 09期

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D O I：

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摘要：

引用

页码：5 / 10

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