Packaging VME circuit boards

被引:0
|
作者
机构
来源
Electron Packag Prod | / 3卷 / 99期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [1] PLUGGABLE INTERFACE PACKAGING FOR PRINTED CIRCUIT BOARDS.
    Uberbacher, E.C.
    [J]. IBM technical disclosure bulletin, 1983, 25 (12): : 6717 - 6718
  • [2] VME CPU BOARDS GO RISC
    ANDREWS, W
    [J]. COMPUTER DESIGN, 1993, 32 (12): : 95 - &
  • [3] Designing with pentium-on-VME boards
    Palmer, D
    [J]. I&CS-INSTRUMENTATION & CONTROL SYSTEMS, 1998, 71 (11): : 61 - +
  • [4] VME CPU BOARDS GO RISC
    ANDREWS, W
    [J]. COMPUTER DESIGN, 1994, 33 (04): : 16 - &
  • [5] Three dimensional packaging of bare IC into printed circuit boards for SIP
    Jung, E
    Wojakowski, D
    Neumann, A
    [J]. ELECTRONIC AND PHOTONIC PACKAGING, ELECTRICAL SYSTEMS AND PHOTONIC DESIGN AND NANOTECHNOLOGY - 2003, 2003, : 153 - 157
  • [6] CDFVME - software framework for testing VME boards
    Gay, C.
    Guo, Y.
    Nahn, S.
    Patrick, J.
    Vejcik, S.
    Votava, M.
    [J]. IEEE Transactions on Nuclear Science, 2000, 47 (2 I) : 259 - 262
  • [7] SPARC VME boards innovate to compete with PowerPC
    Child, J
    [J]. COMPUTER DESIGN, 1996, 35 (10): : 28 - +
  • [8] VME DSP BOARDS CLIMB PERFORMANCE CURVE
    CHILD, J
    [J]. COMPUTER DESIGN, 1995, 34 (02): : 126 - 126
  • [9] CDFVME - Software framework for testing VME boards
    Gay, C
    Guo, Y
    Nahn, S
    Patrick, J
    Vejcik, S
    Votava, M
    [J]. IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2000, 47 (02) : 259 - 262
  • [10] PCI AND VME BOARDS SUPPORT REFLECTIVE MEMORY
    WRIGHT, M
    [J]. EDN, 1995, 40 (25) : 22 - 22