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Plastic packaging of semiconductor laser diodes

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作者：
NTT Opto-electronics Lab, Kanagawa, Japan [1 ]
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来源：
Proc Electron Compon Technol Conf | / 1101-1108期
关键词：
Consumer electronics - Cost effectiveness - Durability - Electronics packaging - Environmental testing - Epoxy resins - Mechanical testing - Optical communication - Plastics applications - Plastics molding - Reliability - Semiconductor device manufacture;
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摘要：
Two kinds of plastic molded laser modules, the coaxial type and the board type, are developed aiming at lower cost laser modules. Under various environmental and endurance tests, these modules show potential for high reliability. The performance of these modules seem comparable to that of hermetically sealed modules used in commercial transmission systems. They are potentially suitable for low cost optical sources in transmission systems.
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