Injection moulding three-dimensional circuit boards

被引：0
|
作者：
Wolf, Manfred [1 ]
机构：
[1] Geschaeftsbereich, Hochtemperaturbestaendige, Kunststoffe, Germany
来源：
Kunststoffe, German plastics | 1989年 / 79卷 / 02期
关键词：
Polysulfones--Amorphous - Thermoplastics--Injection Molding;
D O I：
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学科分类号：
摘要：
In addition to traditional thermosetting substrate materials for circuit boards, a new generation of injection moulded circuit boards is now becoming established. The base materials for these circuit boards are high-temperature-resistant thermoplastics, such as polyether sulphone. Secondary functional components, such as mountings, snapfits, etc., can be integrated into injection-moulded circuit boards in one shot. It is also possible to injection mould circuit boards with three-dimensional geometry so that the package components can be integrated into the electrical functioning of the circuit board.
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页码：20 / 22
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