The Great Recession

被引：0
|
作者：
Carano, Michael [1 ]
机构：
[1] Sales and Marketing
来源：
Printed Circuit Design and Manufacture | 2004年 / 21卷 / 04期
关键词：
Copper plating - Defects - Differential scanning calorimetry - Electroless plating - Metallizing - Shrinkage - Soldering - Thermal effects - Thermoanalysis;
D O I：
暂无
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学科分类号：
摘要：
The resin recession and hole-wall pullaway (HWPA) problems in plating and metallization are discussed. Resin recession occurs during solder shock and other thermal excursion when resins used for laminates are not completely cured. To reduce shrink or recede during thermal excursions, the degree of cure should be checked with thermal mechanical analysis or differential scanning carolimetry. A case study on HWPA defects in plating is also presented. It is suggested that any process change that can lead to a greater than normal dep rate can cause HWPA.
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