FIRST STEPS INTO SURFACE MOUNTING.

被引：0

作者：

Burke, John ^{[1
]}

机构：

[1] Dortrell Ltd, Dortrell Ltd

来源：

EP Electronic Production (London) | 1984年 / 13卷 / 06期

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D O I：

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学科分类号：

摘要：

引用

共 50 条

[1] RELAY RELIABILITY IN SURFACE MOUNTING.
Naples, J.G.
New Electronics, 1988, 21 (02): : 55 - 56
[2] INVESTIGATING PROBLEMS IN SURFACE MOUNTING.
Buckley, David
EP Electronic Production (London), 1985, 14 (04):
[3] SOLDERING TECHNIQUES FOR SURFACE MOUNTING.
Burke, John
EP Electronic Production (London), 1985, 14 (03):
[4] ADAPTING CONNECTORS FOR RELIABLE SURFACE MOUNTING.
Kikuta, Shigeru
JEE. Journal of electronic engineering, 1986, 23 (240): : 42 - 43
[5] PASSIVE COMPONENTS LEAD USERS INTO SURFACE MOUNTING.
Pound, Ronald
Electronic Packaging and Production, 1987, 27 (06): : 59 - 60
[6] RESISTOR MOUNTING.
Henley, B.L.
Joy, E.F.
Nealy, J.C.
Weber, M.
Wheeler, W.R.
IBM technical disclosure bulletin, 1983, 26 (05): : 2220 - 2221
[7] Self-assembly of altitudiinal molecular rotors for surface mounting.
Caskey, DC
Michl, J
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2004, 227 : U1290 - U1290
[8] FLEXIBLE APPROACH TO CHIP CARRIER MOUNTING.
Kirby, Peter
Electronic Engineering (London), 1984, 56 (691): : 39 - 42
[9] FULL WAFER SIZE LSI MOUNTING.
Nishi, Isao
Moriya, Kunio
Osaki, Takaaki
Tsunetsugu, Hideki
Review of the Electrical Communication Laboratories (Tokyo), 1979, 27 (1-2): : 92 - 96
[10] CONNECTOR TECHNOLOGY FOR HIGH-DENSITY MOUNTING.
Hirai, Yuji
JEE. Journal of electronic engineering, 1988, 25 (254): : 37 - 39