EVALUATION OF SOLDER BUMP FLIP CHIPS IN THICK FILM SOLDER REFLOW HYBRIDS.

被引：0
|
作者：
Brownewell, Don
机构：
来源：
Insulation/Circuits | 1975年 / 21卷 / 05期
关键词：
SEMICONDUCTOR DEVICE MANUFACTURE - SEMICONDUCTOR DEVICES - SOLDERS;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Device assembly techniques for hybrid circuits, and semiconductor devices are illustrated and comparatively tabulated. Both process and assembly flow comparison, and economic, and design and operational decision matrix is shown.
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页码：33 / 36
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