Cluster expansions at alloy surfaces: Formalism and application to segregation in Ni-Cu

被引:0
|
作者
Ouannasser, S.
Wille, L. T.
Dreysse, H.
机构
来源
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [1] Cluster expansions at alloy surfaces: Formalism and application to segregation in Ni-Cu
    Ouannasser, S
    Wille, LT
    Dreysse, H
    PHYSICAL REVIEW B, 1997, 55 (21): : 14245 - 14256
  • [2] Numerical analysis on Si deoxidation of molten Ni and Ni-Cu alloy by quadratic formalism
    Miki, T
    Ishii, F
    Hino, M
    MATERIALS TRANSACTIONS, 2003, 44 (09) : 1817 - 1823
  • [3] Size effects on surface segregation in Ni-Cu alloy thin films
    Yan, X. L.
    Wang, J. Y.
    THIN SOLID FILMS, 2013, 529 : 483 - 487
  • [4] Investigation of segregation during oxidation of Ni-Cu alloy by in situ photoelectron spectroscopy
    Doi, Takashi
    Nishiyama, Yoshitaka
    Yoshigoe, Akitaka
    Teraoka, Yuden
    SURFACE AND INTERFACE ANALYSIS, 2016, 48 (07) : 685 - 688
  • [5] Alloy formation and strength of Ni-Cu interaction in Ni-Cu/ZnO catalysts
    Wang, YQ
    Gao, TY
    REACTION KINETICS AND CATALYSIS LETTERS, 2000, 70 (01): : 91 - 96
  • [6] Alloy Formation and Strength of Ni-Cu Interaction in Ni-Cu/ZnO Catalysts
    Yaquan Wang
    Tingyuan Gao
    Reaction Kinetics and Catalysis Letters, 2000, 70 : 91 - 96
  • [7] Preparation of Graphene/Ni-Cu Alloy Composite on Ni-Cu Alloy Template Made by Selective Laser Melting
    Liu Z.
    Huang Y.
    Yang X.
    He Y.
    Li Z.
    Yan C.
    Cailiao Yanjiu Xuebao/Chinese Journal of Materials Research, 2021, 35 (01): : 1 - 6
  • [8] RADIATION-INDUCED SEGREGATION IN NI-CU ALLOYS
    WAGNER, W
    REHN, LE
    WIEDERSICH, H
    NAUNDORF, V
    PHYSICAL REVIEW B, 1983, 28 (12): : 6780 - 6794
  • [9] Improvement of smelting technology for Ni-Cu alloy
    Taigang Alloy Co., Ltd., Shenzhen, China
    Tezhong Zhuzao Ji Youse Hejin, 2007, 11 (863-864):
  • [10] REDUCTION AND FORMATION OF ALLOY IN NI-CU CATALYSTS
    VASS, MI
    CONTESCU, C
    REVISTA DE CHIMIE, 1978, 29 (09): : 828 - 831