Three-dimensional simulation method of mold filling during microchip plastic encapsulation

被引：0
|
作者：
Wang, Hui [1 ]
Zhou, Hua-Min [1 ]
Li, De-Qun [1 ]
机构：
[1] State Key Laboratory of Materials Processing and Die and Mold Technology, Huazhong University of Science and Technology, Wuhan 430074, China
来源：
Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University | 2010年 / 44卷 / 02期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：176 / 179
相关论文
共 50 条
  • [1] Three-dimensional simulation of plastic molding processes: Application to microchip encapsulation
    Han, RH
    Gupta, M
    CONFERENCE PROCEEDINGS AT ANTEC '98: PLASTICS ON MY MIND, VOLS I-3: VOL I; PROCESSING, VOL II; SPECIAL AREAS, VOL III; MATERIALS, 1998, 44 : 1211 - 1215
  • [2] Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement
    Abdullah, M. K.
    Abdullah, M. Z.
    Mujeebu, M. A.
    Gitano, Horizon
    Ariff, Z. M.
    Razali, R.
    Ahmad, K. A.
    JOURNAL OF ELECTRONIC PACKAGING, 2010, 132 (01) : 0145021 - 0145026
  • [3] Three-dimensional simulation of microchip encapsulation process
    Han, RH
    Shi, LH
    Gupta, M
    POLYMER ENGINEERING AND SCIENCE, 2000, 40 (03): : 776 - 785
  • [4] Three-dimensional simulation of reactive polymeric flow during microchip encapsulation
    Han, Ruihua
    Gupta, Mahesh
    Crouthamel, David L.
    Journal of Injection Molding Technology, 2002, 6 (03): : 203 - 219
  • [5] Three-dimensional modeling of mold filling in microelectronics encapsulation process
    Chang, RY
    Yang, WH
    Hwang, SJ
    Su, F
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2004, 27 (01): : 200 - 209
  • [6] Numerical simulation of three-dimensional mold filling in resin transfer molding
    Shojaei, A
    Ghaffarian, SR
    Karimian, SMH
    JOURNAL OF REINFORCED PLASTICS AND COMPOSITES, 2003, 22 (16) : 1497 - 1529
  • [7] Three-dimensional simulation of mold filling process by a least-squares finite element method
    Tang, LQ
    Pochiraju, K
    Chassapis, C
    Manoochehri, S
    XIITH INTERNATIONAL CONGRESS ON RHEOLOGY, PROCEEDINGS, 1996, : 434 - 434
  • [8] A robust finite volume method for three-dimensional filling simulation of plastic injection molding
    Liang, Junjie
    Luo, Wan
    Huang, Zhigao
    Zhou, Huamin
    Zhang, Yun
    Zhang, Yi
    Fu, Yang
    ENGINEERING COMPUTATIONS, 2017, 34 (03) : 814 - 831
  • [9] Three-dimensional numerical simulation of injection mold filling with a finite-volume method and parallel computing
    Zhou, Jian
    Turng, Lih-Sheng
    ADVANCES IN POLYMER TECHNOLOGY, 2006, 25 (04) : 247 - 258
  • [10] Stabilized filling simulation of microchip encapsulation process
    Wang, Hui
    Zhou, Huamin
    Zhang, Yun
    Li, Dequn
    MICROELECTRONIC ENGINEERING, 2010, 87 (12) : 2602 - 2609
12345