Effect of Si on the microstructure and thermal conductivity of pressureless infiltrated SiCp/Al composites

被引：0
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作者：
Ma, Qiang [1 ]
He, Xinbo [1 ]
Ren, Shubin [1 ]
Qu, Xuanhui [1 ]
机构：
[1] School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China
来源：
Beijing Keji Daxue Xuebao/Journal of University of Science and Technology Beijing | 2008年 / 30卷 / 01期
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页码：45 / 48
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