Optimization design of water-cooled heat sink applied to large-capacity power electronic equipment

被引：0
|
作者：
Jie G. [1 ]
Sun C. [1 ]
Wang G. [1 ]
Nie Z. [1 ]
Meng Q. [1 ]
机构：
[1] Institute of Power Electronics Technology, Naval University of Engineering
来源：
Jixie Gongcheng Xuebao/Journal of Mechanical Engineering | 2010年 / 46卷 / 02期
关键词：
Computational fluid dynamics(CFD); Optimization design; Power electronics; Water-cooled heat sink;
D O I：
10.3901/JME.2010.02.099
中图分类号：
学科分类号：
摘要：
In order to enhance the heat-transfer capability and control the temperature uniformity of the water-cooled heat sink, the relations between the dimensionless thermal resistance and three channel parameters(the number of channels, fin height and fin duty ratio of the heat sink are deduced theoretically in laminar flow range on the condition that the outline dimensions of the heat sink with plate fins and the fluid volume flow are chosen firstly. Then, a parameter optimizing design method with application to arbitrary heat sink dimensions which is of good directive significance in engineering is presented according to these variation relations. The results of simulation and experiment prove the effectiveness of the method and show that, the heat-sink with small channel sizes can reach higher heat-transfer efficiency and is more effective to cool the component with big heat-flux density, the heat-transfer efficiency decreases with the increase of volume flow, so the volume flow should be selected reasonably with comprehensive consideration of the control requirements of the heat-sink flow resistance and fluid mean temperature rise. ©2010 Journal of Mechanical Engineering.
引用
收藏
页码：99 / 105
页数：6
相关论文
共 14 条
  • [1] Thomas B., Donald G.H., Optimal pulse width modulation for three-level inverters, IEEE Trans. Power. Elec., 20, 1, pp. 41-47, (2001)
  • [2] Li Y., High performance and high power AC motor variable speed drives-status and trends, Transactions of China Electrotechnical Society, 20, 2, pp. 3-10, (2005)
  • [3] Hefner A.R., A dynamic electro-thermal model for the IGBT, IEEE Trans. Ind. Applicat., 30, 2, pp. 394-405, (1994)
  • [4] Chan S., Paolo M., Mauro C., Et al., Thermal component model for electrothermal analysis of IGBT module systems, IEEE Trans. Advanced Packing, 24, 3, pp. 401-406, (2001)
  • [5] Rael S., Schaeffer C., Perret R., Electrothermal characterization of IGBT, Proceeding of IEEE-IAS'94, pp. 1336-1343, (1994)
  • [6] Kevin A.M., Yogendra K.J., Gerhard H.S., Thermal characterization of a liquid cooled AlSiC base plate with integral pin fins, IEEE Trans. Comp. Packaging Technol., 24, 2, pp. 3-10, (2001)
  • [7] Knight R.W., Hall D.J., Goodling J.S., Et al., Heat sink optimization with application to microchannels, IEEE Trans. Comp. Hybrids Manufact. Technol., 15, 5, pp. 832-842, (1992)
  • [8] Meysenc L., Saludjian L., Brieard A., A high heat flux IGBT micro exchanger setup, IEEE Trans. Comp. Hybrids Manufact. Technol., 20, 3, pp. 334-341, (1997)
  • [9] Charlotte G., Christian S., Integrated micro heat sink for power multichip module, IEEE Trans. Ind. Applicat., 36, 1, pp. 217-221, (2000)
  • [10] Lee T.Y., Design optimization of an integrated liquid-cooled IGBT power module using CFD technique, IEEE Trans. Comp. Packaging Technol., 23, 1, pp. 55-60, (2000)
12