An analysis of elastic-plastic-creep damage for small punch creep test

被引：0
|
作者：
Zheng, Yang-Yan [1 ]
Qian, Zhen-Mei [1 ]
Ling, Xiang [1 ]
机构：
[1] School of Mechanical and Power Engineering, Nanjing University of Technology, Nanjing 210009, China
来源：
Gongcheng Lixue/Engineering Mechanics | 2007年 / 24卷 / 09期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：148 / 153
相关论文
共 50 条
  • [1] A SIMPLIFIED METHOD FOR ELASTIC-PLASTIC-CREEP STRUCTURAL-ANALYSIS
    KAUFMAN, A
    JOURNAL OF ENGINEERING FOR GAS TURBINES AND POWER-TRANSACTIONS OF THE ASME, 1985, 107 (01): : 231 - 237
  • [2] SIMPLIFIED METHOD FOR ELASTIC-PLASTIC-CREEP STRUCTURAL-ANALYSIS
    KAUFMAN, A
    MECHANICAL ENGINEERING, 1984, 106 (07) : 90 - 90
  • [3] Elastic-plastic-creep simulation of Pb/Sn solder alloys by separation of plastic and creep
    Ohguchi, K
    Sasaki, K
    JSME INTERNATIONAL JOURNAL SERIES A-SOLID MECHANICS AND MATERIAL ENGINEERING, 2003, 46 (04) : 559 - 566
  • [4] COMBINED ELASTIC-PLASTIC-CREEP ANALYSIS OF 2-DIMENSIONAL BODIES
    SCHULTZ, CC
    VANFOSSE.DB
    MECHANICAL ENGINEERING, 1971, 93 (08) : 52 - &
  • [5] Creep life analysis by an energy model of small punch creep test
    Yang, Sisheng
    Ling, Xiang
    Zheng, Yangyan
    Ma, Rongbiao
    MATERIALS & DESIGN, 2016, 91 : 98 - 103
  • [6] Finite element elastic-plastic-creep and cycle life analysis of a cowl lip
    Arya, V.K.
    Melis, M.E.
    Halford, G.R.
    Fatigue and Fracture of Engineering Materials and Structures, 1991, 14 (10): : 967 - 977
  • [7] ELASTIC-PLASTIC-CREEP BEHAVIOR OF A COMPACT-TENSION SPECIMEN
    HYDE, TH
    LOW, KC
    WEBSTER, JJ
    JOURNAL OF STRAIN ANALYSIS FOR ENGINEERING DESIGN, 1983, 18 (03): : 157 - 166
  • [8] SIMPLIFIED METHOD FOR ELASTIC-PLASTIC-CREEP STRUCTURAL ANALYSES.
    Kaufman, Albert
    NASA Technical Memorandum, 1984,
  • [9] A SIMPLIFIED ANALYSIS METHOD FOR COMPLEX PIPING SYSTEMS IN ELASTIC-PLASTIC-CREEP RANGE
    WATANABE, O
    OHTSUBO, H
    JOURNAL OF PRESSURE VESSEL TECHNOLOGY-TRANSACTIONS OF THE ASME, 1985, 107 (02): : 148 - 156
  • [10] CBGA solder joint reliability evaluation based on elastic-plastic-creep analysis
    Pang, JHL
    Seetoh, CW
    Wang, ZP
    JOURNAL OF ELECTRONIC PACKAGING, 2000, 122 (03) : 255 - 261
12345