Small loop heat pipe with plastic wick for electronics cooling

被引:0
|
作者
Department of Aerospace Engineering, Nagoya University, Nagoya 464-8603, Japan [1 ]
机构
来源
Jpn. J. Appl. Phys. | / 11 PART 2卷
关键词
Compendex;
D O I
暂无
中图分类号
学科分类号
摘要
Evaporators
引用
收藏
相关论文
共 50 条
  • [1] Small Loop Heat Pipe with Plastic Wick for Electronics Cooling
    Nagano, Hosei
    Nishigawara, Masahito
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2011, 50 (11)
  • [2] Experimental Study of a Loop Heat Pipe with Direct Pouring Porous Wick for Cooling Electronics
    Cai, Bing
    Deng, Weizhong
    Wu, Tong
    Wang, Tingting
    Ma, Zhengyuan
    Liu, Wei
    Ma, Lei
    Liu, Zhichun
    PROCESSES, 2021, 9 (08)
  • [3] Loop heat pipe technology for electronics cooling
    Khrustalev, D
    2001 HD INTERNATIONAL CONFERENCE ON HIGH-DENSITY INTERCONNECT AND SYSTEMS PACKAGING, PROCEEDINGS, 2001, 4428 : 375 - 380
  • [4] Development of a MEMS micro loop heat pipe for electronics cooling
    Shuja, A.
    Parimi, S.
    Medis, P.
    Gerner, F. M.
    Henderson, H. T.
    Gerner, F. M.
    THERMES 2007: THERMAL CHALLENGES IN NEXT GENERATION ELECTRONIC SYSTEMS, 2007, : 233 - +
  • [5] THE PERFORMANCE ENHANCEMENT OF A HEAT PIPE FOR POWER ELECTRONICS COOLING WITH A PARTIALLY APPLIED HYBRID WICK
    Boo, Joon Hong
    Kim, Hyun Gon
    Han, Chang Woo
    PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2017, 2017,
  • [6] Ceramic flat plate evaporator for loop heat pipe cooling of electronics
    Zimbeck, Walter
    Chaney, Jared
    Espinoza, Patricio
    Kroliczek, Edward
    Bugby, David C.
    Yuri, James
    Advances in Electronic Packaging 2005, Pts A-C, 2005, : 177 - 182
  • [7] Multilayer wick structure of loop heat pipe
    Cal, Qingjun
    Chen, Chung-Lung
    Asfia, Julie F.
    PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION 2007, VOL 1: ADVANCES IN AEROSPACE TECHNOLOGY, 2008, : 3 - 8
  • [8] Thermal characterization and wick optimization of mini-grooved flat heat pipe for electronics cooling
    Fei Xin
    Ting Ma
    Qiuwang Wang
    Yuying Yan
    Wenchao Tian
    Journal of Thermal Analysis and Calorimetry, 2022, 147 : 14859 - 14872
  • [9] Thermal characterization and wick optimization of mini-grooved flat heat pipe for electronics cooling
    Xin, Fei
    Ma, Ting
    Wang, Qiuwang
    Yan, Yuying
    Tian, Wenchao
    JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, 2022, 147 (24) : 14859 - 14872
  • [10] Design, fabrication and thermal performance of a novel ultra-thin loop heat pipe with printed wick structure for mobile electronics cooling
    Chen, Anqi
    Jiang, Fan
    Dong, Jiajia
    Chen, Jeffrey
    Zhu, Yuan
    APPLIED THERMAL ENGINEERING, 2022, 200